| Items | Specifications |
|---|---|
| Microfocus X-ray source | Max. high voltage: 225 kVp Feature recognition: <1 µm Min object-focus distance: 0.4 mm X-Ray cone: 170° |
| X-Ray detection | |
| Detector elements | 1944 x 1536 CMOS flat pannel 1248 x 1248 a-Si flat panel 1024 x 1024 flat panel sensor |
| Detector Effective Area | 145x115 mm2 CMOS 120x120 mm2 a-Si 50x50 mm2 |
| Digital Output | 14 bits CMOS, 12 bits a-Si |
| Detector movement | 300mm horizontal & vertical |
| Sample micrometric manipulator | |
| X stage | travel 800 mm, loading capacity 30 kg |
| Z stage | travel 300 mm, loading capacity 6 kg |
θ stage |
accuracy 0.03°, loading capacity 20 kg |
| Probe dimensions | Diameter < 40 mm Height < 500 mm Weight < 4 kg |
| Magnification Factor | <2000 |
| Source-Detector Distance | 1000 mm typical |
| Source-Object Distance |
> 0.5 mm typical |
| Spatial Resolution | >1µm |
| Density Resolution |
aprox. 1% |
| Scan Method |
Cone beam CT Full scan (360º.) Short Scan (180º+1/2 fan angle) |
| Geometry Calibration Program |
Center of Rotation Vertical & Horizontal Alignment |
| Scanning Time |
approx. 20min. (720 views) |
| Feldkamp Algorithm | approx. 1 min. (512x512, 512 slices) approx. 12 min. (1024x1024, 1024 slices) |
| 3D Reconstruction Time | 20min. (1024x1024, 512 slices) |
| Output data format | 32 float 16 bits integer |
| Artefact correction | Ring artefact removal Beam hardening reduction |