x-ray facility
Items Specifications
Microfocus X-ray source Max. high voltage: 225 kVp
Feature recognition: <1 µm
Min object-focus distance: 0.4 mm
X-Ray cone: 170°
   
X-Ray detection  
Detector elements 1944 x 1536 CMOS flat pannel
1248 x 1248 a-Si flat panel
1024 x 1024 flat panel sensor
Detector Effective Area 145x115 mm2 CMOS
120x120 mm2 a-Si
50x50 mm2
Digital Output 14 bits CMOS, 12 bits a-Si
Detector movement 300mm horizontal & vertical
   
Sample micrometric manipulator
X stage travel 800 mm, loading capacity 30 kg
Z stage travel 300 mm, loading capacity 6 kg

θ stage

accuracy 0.03°, loading capacity 20 kg
Probe dimensions Diameter < 40 mm
Height < 500 mm
Weight < 4 kg
   
Magnification Factor <2000
Source-Detector Distance 1000 mm typical
Source-Object Distance
> 0.5 mm typical
Spatial Resolution >1µm
Density Resolution
aprox. 1%
Scan Method
Cone beam CT
Full scan (360º.)
Short Scan (180º+1/2 fan angle)
Geometry Calibration Program
Center of Rotation
Vertical & Horizontal Alignment
Scanning Time
approx. 20min. (720 views)
Feldkamp Algorithm approx. 1 min. (512x512, 512 slices)
approx. 12 min. (1024x1024, 1024 slices)
3D Reconstruction Time 20min. (1024x1024, 512 slices)
Output data format 32 float
16 bits integer
Artefact correction Ring artefact removal
Beam hardening reduction

Back